EDS markers
Obverse
Markers for this die state are not yet known.
Reverse
Markers for this die state are not yet known.
MDS markers
Obverse
E/W die scratches can be seen running outside along the front of lincolns face down under his chin. Multiple die cracks can be found in lincolns hair. Die gouge can be seen below the 5 of the date. A die gouge can be found in the fold of lincolns lapel. A die gouge can be seen just east of lincolns eye.
Reverse
A die chip can be found on the T of CENT. Multiple die scratches can be found inside the C of CENT. Multiple die scratches can be found around the second T of STATES. A die gouge can be found inside the O of OF.
LDS markers
Obverse
Markers for this die state are not yet known.
Reverse
Markers for this die state are not yet known.
Value Information
The values represented here are based on sales results, auction results, and information derived from overall percentage based values given for lower grade specimens in other guides and sales sheets. It is not intended to be interpreted as a buy or sell price nor intent to purchase on behalf of this site. It is only to be used as a guide
  F...................3.00
   VF..................6.00
   EF..................9.00
   AU..................12.00
   UNC.................16.00
   MS63................20.00
   MS65................25.00
Quick Links...
Go to the date guide main page
Back to the 1956 date guide page
Check out the 1955 date guide
Check out the 1957 date guide
1956P-1DO-007
| CLASS 2 (MDS)
CONECA: DDO-001  |  Crawford:UNKNOWN
Wexler: WDDO-008  |  FS#:UNKNOWN
coin photographed is credited to Brady Douglas.20210828
CCW spread can be seen in IGWT and in some die states can be paired with DDR-008.

 

Copyright © 2001-2023 coppercoins.com, all rights reserved. All design elements, images, and content are copyrighted material and may not be duplicated for any purpose without sole written consent of the owners of coppercoins.com. This site programmed in PHP using MySQL database resources. Please support open source programming.